Annie Xian Zhang

• PhD (2016) Columbia University (Mechanical Engineering)
• BS (2009) University of Michigan - Shanghai Jiao Tong University joint program (visiting student at Purdue University) (Mechanical Engineering)

• Journal Reviewer of >90 publications from Nature Communications, Small, Nano Letters, ACS Nano, 2D Materials, Physics Review B, Scientific Reports, etc.
• 2022 MRS Spring Meeting - Symposium "Thermal Processes and Management Under Unconventional Conditions" Symposium, Organizer
• 2021 21st Symposium on Thermophysical Properties - Track "Thermal Properties of Nanostructured Materials" Chair
• 2021 IEEE NEMS Program co-Chair
• 2021 IEEE NEMS - Invited Session "Thermal management in Micro/Nano Systems" Chair
• 2019-2021 ASME International Conference on Micro- and Nanosystems Symposium Chair
• National Science Foundation Panelist
• 2018 20th Symposium on Thermophysical Properties - Track "Thermal Properties of Nanostructured Materials" Chair

• Institute of Electrical and Electronics Engineers Member
• Materials Research Society Member
• American Chemical Society Member
• American Physical Society Member
• American Society of Mechanical Engineers Member

Journal Article

1. Ye, F.; Liu, Q.; Xu, B.; Feng, P.; Zhang, X. (2023). Ultra-High Interfacial Thermal Conductance via Double hBN Encapsulation for Efficient Thermal Management of 2D Electronics. Small (Featured as Cover Article) (2205726 ed., vol. 19).
2. Zhang, X. (2020). Please check the website of "https://xazhang.weebly.com/publications.html" for publication information..